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Not every application fits a standard format. In addition to common wafer sizes, we process substrates with non-standard dimensions and custom geometries. Our flexible equipment and process concepts allow us to adapt the ion implantation process to your specific components and requirements.
In addition to standard wafer formats, we can also process smaller samples and customer-specific geometries. Typical formats include:
Whether a specific sample can be processed depends on factors including its dimensions, material, masking requirements, and handling requirements.
| Category | Description |
|---|---|
| Wafer sizes | 2", 3", 100 mm, 125 mm, 150 mm, 200 mm |
| Non-standard geometries | Highly flexible processing subject to technical feasibility; custom process cassettes may be required |
| Masked implantation | Possible using suitable process cassettes / masking solutions, subject to technical feasibility |
| Sample thickness | Other sample formats typically up to approx. 1 mm thickness, depending on material, geometry, and mounting |
| Process type | Single-wafer / single-sample processing with manual loading and unloading of process cassettes |
| Wafer handling | 25 process cassettes per magazine; front-side and backside implantation possible |
| Rotation | No rotation during irradiation |
| Tilt | Standard 0°/7°; continuously adjustable on most systems |
We process 2″, 3″, 100 mm, 125 mm, 150 mm, and 200 mm wafers for ion implantation.
Custom geometries can be processed subject to technical feasibility. Customer-specific process cassettes are often required and can also be designed to enable masked implantation.
For custom samples, the typical sample thickness is up to approximately 1 mm. The exact technical feasibility depends on the material, geometry, mounting, and process requirements.
Backside implantation is possible using our cassette-based handling system. The wafer front side remains contact-free during handling.
Our double-sided open process cassettes enable both frontside and backside implantation. By turning the cassette, either side of the wafer can be exposed for implantation.
Dr. Roman Böttger
Chief Operating Officer
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