D-Band - HZDR Innovation

The first low-cost VIS–IR sensor in a single element

D-BAND is a revolutionary dual-band optical sensor that delivers seamless detection across the visible and short-wave infrared (SWIR) spectrum — all in a single, CMOS-compatible element. With a low cost production per device, D-BAND enables compact, high-performance sensing for mass-market applications.

Designed for room-temperature operation, RoHS compliance, and easy system integration, D-BAND offers a disruptive alternative to bulky, expensive multi-material detector solutions.

Key features

Broad spectral coverage: 300–1900 nm (VIS–NIR–SWIR)
Monolithic sensor design: Single-element architecture
Ultra-low cost: < 1 €/device — scalable and accessible
CMOS-compatible: Integrates directly with standard electronics
Stable at room temperature: No cooling or vacuum packaging required
Compact & robust: Ideal for portable and embedded platforms

Application fields

D-BAND unlocks new possibilities across a wide range of fields:

Agriculture: Plant health diagnostics, precision farming
LiDAR & 3D sensing: Advanced depth and material analysis
Medical devices: Pulse oximetry, non-invasive glucose sensing
Automotive: Proximity and motion detection, in-cabin monitoring
Industrial: Inline process monitoring and quality control

Technology

A silicon breakthrough for broadband photodetection

At the core of D-BAND is a proprietary silicon-based photodetector structure that leverages deep-level impurity engineering to extend spectral sensitivity far beyond the visible range — all the way to 1900 nm.

Our approach enables:

Single-material design — eliminating the need for compound semiconductors
High absorption efficiency in both visible and SWIR bands
Room-temperature operation — no thermoelectric or cryogenic cooling
Mass manufacturability using standard CMOS processing

This novel technology makes D-BAND uniquely positioned to disrupt the optical sensing landscape by replacing expensive, multi-material, multi-element stacks with a single, compact chip.

We believe in a future where spectral sensing is ubiquitous, affordable, and scalable.

Team

Experts in photonics, materials, and scalable innovation

The D-BAND project is powered by a multidisciplinary team of scientists, engineers, and innovators with deep expertise in semiconductor physics, integrated photonics, and advanced sensor technologies.

Our team combines years of experience in:

Silicon-based optoelectronics and device engineering
CMOS-compatible fabrication and scalable manufacturing
Broadband optical sensing and materials innovation
Translating lab-scale breakthroughs into real-world applications

We work at the intersection of academic research and industrial development, with a strong focus on transforming cutting-edge science into high-impact products that meet the performance, cost, and integration needs of today’s most demanding markets.

United by a shared vision: making broadband sensing simple, scalable, and everywhere.

contact

Would you like to find out more about the benefits and possible applications? Discuss your requirements with us.

Dr. Vladimir Voroshnin (Business Development)
Tel. +49 351 260 3944
v.voroshnin@hzdri.de