Wafer processing

HZDR Innovation delivers semiconductor preparation of Silikon and other materials as GaAs, SiC and Diamond. The activities contain all wafer processes including ion implantation, production of test structures and devices.

The cleanroom class-100 is equipped with:

  • Process Technologies
    • Wet chemical cleaning and isotrope etching
    • Wet chemical anisotropy and selective etching of silicon
    • Photolithography
    • Reactive ion etching (SF6, CF4)
    • Thermal oxydation, diffusion and annealing
    • Thermal short time processing (annealing and oxydation)
    • High temperature vacuum annealing
  • Thin Film Technology
    • Sputtering (DC, RF and Magnetron)
    • Evaporation (electron beam, resistiv)
    • Focused Ion Beam
  • Direct structuring in ┬Ám and nm scale
    • Writing implantation
    • Ion beam assisted deposition
    • Development of alloyed liquid metal ion sources
  • Device Packaging
    • Ultrasonic bonding
    • Adhesive bonding techniques
  • Metrology
    • Optical thickness measurement (interferometric, ellipsometric)
    • Optical width measurement
    • Optical microscopy
    • Surface profiling and roughness measurement
    • Atomic force microscopy (AFM)
    • Electrical measurements (I/V, MOS-C/V)
  • Computer aided design
    • Mask design (AUTOCAD)